Interactive tools, material data, and design guidelines for high-frequency Rogers RO4003C PCB design. From impedance calculation to stackup optimization — everything RF engineers need.
Key electrical, thermal, and mechanical properties of Rogers RO4003C high-frequency laminate for PCB design and engineering reference.
At 10 GHz / 23°C. Process-controlled Dk provides tight tolerance for impedance-critical Rogers RO4003C PCB designs.
Measured at 10 GHz. Extremely low-loss tangent enables high-performance signal integrity up to mmWave frequencies.
Superior thermal management vs. standard PTFE materials. Enables reliable operation in high-power RF applications.
Coefficient of thermal expansion comparable to FR-4, ensuring reliable plated through-hole interconnects.
High thermal stability for lead-free assembly processes and demanding operating environments.
Excellent adhesion to copper ensures robust interconnects during manufacturing and service life.
Ultra-low moisture uptake maintains dielectric performance stability across varying humidity conditions.
Self-extinguishing material meets strict fire safety requirements without halogenated flame retardants.
Dielectric constant stability across frequency — critical data for Rogers RO4003C PCB impedance modeling.
| Frequency | Dk (Process) | Dk (Design) | Df (tan δ) | Test Method |
|---|---|---|---|---|
| 2.5 GHz | 3.38 | 3.55 | 0.0027 | Clamped Stripline |
| 5 GHz | 3.38 | 3.55 | 0.0027 | Clamped Stripline |
| 10 GHz | 3.38 | 3.55 | 0.0027 | Clamped Stripline |
| 20 GHz | 3.37 | 3.54 | 0.0030 | Differential Phase Length |
| 30 GHz | 3.36 | 3.53 | 0.0032 | Differential Phase Length |
| 40 GHz | 3.35 | 3.52 | 0.0035 | Differential Phase Length |
Calculate characteristic impedance for microstrip and stripline traces on Rogers RO4003C PCB with real-time results.
Standard and hybrid stackup configurations for Rogers RO4003C PCB designs with FR-4 or RO4450F prepreg bonding.
RO4003C + FR-4 (Optimized for Cost & Performance)
★ RF signals routed on L1 (RO4003C microstrip) · Low-frequency / digital on L3 (FR-4) · Reduces cost vs all-RO4003C stackup
Proven guidelines from experienced RF/microwave engineers for optimal Rogers RO4003C PCB performance.
Rogers specifies two Dk values. The Process Dk (3.38) is for quality control. Use the Design Dk (3.55) in your EDA tool for accurate impedance modeling. This accounts for copper roughness and real-world operating conditions.
ImpedanceFor microstrip-to-stripline transitions, place ground vias with spacing no greater than λ/20 at the maximum operating frequency. At 10 GHz on RO4003C, this means via spacing ≤ 0.8 mm (31.5 mils).
LayoutSolder mask has a Dk of ~3.5–4.0 and can shift impedance by 2–5Ω. Remove solder mask from critical RF traces and matching networks. Use mask-defined pads only where required for assembly.
Signal IntegrityRO4003C uses electrodeposited copper. Specify the correct copper foil type (standard ED or reverse-treat) in your loss model. Smooth copper (reversed treated) reduces insertion loss by 0.02–0.05 dB/inch above 10 GHz.
Loss OptimizationUse Rogers RO4003C only on layers that carry RF signals. Combine with standard FR-4 for power, ground, and low-speed digital layers. This can reduce material cost by 40–60% while preserving RF performance.
CostFor designs above 10 GHz, specify via back-drilling (controlled depth drilling) to remove unused via stubs. Stubs act as resonant structures and can cause notch filters in your signal path.
mmWaveKey applications leveraging the low-loss, stable dielectric properties of Rogers RO4003C across industries.
Low Df and tight Dk tolerance enable consistent beam-forming performance across large antenna arrays.
1 – 18 GHzStable dielectric constant over temperature ensures reliable up/down conversion in SATCOM modules.
Ku / Ka-bandIdeal for massive MIMO antenna panels and beamforming networks in sub-6 GHz and mmWave 5G infrastructure.
3.5 – 39 GHz77 GHz FMCW radar for adaptive cruise control, blind-spot detection, and autonomous driving sensor fusion.
24 / 77 GHzLow insertion loss and repeatable electrical properties make RO4003C ideal for calibration substrates and test fixtures.
DC – 40 GHz+Biocompatible PCB substrates for microwave ablation, hyperthermia treatment, and diagnostic imaging antenna feeds.
0.9 – 6 GHzMIL-spec applications including EW systems, signal intelligence, GPS receivers, and IFF transponders.
Multi-bandThermal conductivity of 0.71 W/m/K supports high-power GaN and LDMOS PA designs with reliable heat dissipation.
0.7 – 6 GHzKey fabrication parameters and processing guidelines for producing high-quality Rogers RO4003C PCBs.
Understand cost drivers and strategies to optimize your Rogers RO4003C PCB budget without sacrificing performance.
RO4003C material costs ~5–8× standard FR-4 per panel. Smart stackup design is the most effective cost-reduction lever.
Get a Rogers RO4003C PCB Quote from PCBSync →
Rogers RO4003C is a glass-reinforced hydrocarbon/ceramic laminate designed for high-frequency PCB applications. It features a low dielectric constant (Dk) of 3.38 at 10 GHz and a very low dissipation factor (Df) of 0.0027, making it ideal for RF, microwave, and millimeter-wave circuit designs. Unlike traditional PTFE-based laminates, RO4003C can be processed using standard FR-4 fabrication methods, significantly reducing manufacturing complexity and cost.
Rogers RO4003C has two specified dielectric constant values: a Process Dk of 3.38 ± 0.05 (used for quality control testing via clamped stripline at 10 GHz) and a Design Dk of 3.55 (recommended for circuit design and impedance modeling). Engineers should use the Design Dk value in their EDA simulation tools for accurate impedance predictions, as it accounts for copper roughness effects and practical operating conditions.
Yes — this is one of the biggest advantages of RO4003C. Unlike PTFE materials that require sodium-etching for plating adhesion and special drill parameters, RO4003C uses standard FR-4 fabrication processes including drilling, plating, etching, and solder mask application. This means any PCB shop with FR-4 capability can fabricate RO4003C boards, resulting in lower manufacturing costs and faster lead times compared to PTFE alternatives.
Both are thermoset laminates from the RO4000 series. RO4003C has a lower Dk (3.38 vs 3.48) and lower Df (0.0027 vs 0.0037), making it better for low-loss applications. RO4350B is UL-approved for higher voltage applications and has slightly better thermal conductivity. Choose RO4003C when loss performance is the priority; choose RO4350B when you need UL certification or better power handling.
Rogers RO4003C PCB excels in applications requiring low signal loss and stable performance up to 40 GHz and beyond, including: phased array radar systems, 5G massive MIMO antenna panels, automotive 77 GHz ADAS radar, satellite communication modules, point-to-point microwave links, power amplifier circuits, GPS and navigation receivers, RF test fixtures, and medical microwave devices.
Rogers RO4003C raw material costs approximately 5–8× more than standard FR-4 laminate per panel. However, finished PCB cost depends on many factors: layer count, board size, copper weight, surface finish, and quantity. The biggest cost-saving strategy is using a hybrid stackup (RO4003C only on RF layers, FR-4 on others), which can reduce total material cost by 40–60%. For accurate pricing, request a quote from PCBSync at pcbsync.com/ro4003c-pcb/.
From prototype to production — PCBSync delivers precision-manufactured Rogers RO4003C PCBs with expert engineering support.